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TDP08H1SBD1R
Tdp0 系列
超微型表面贴装半间距侧面起动拨码开关

DIP TDP product image

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3D 模型
设计人员将 C&K 的 TDP 系列超微型表面贴装半间距侧起动拨码开关用于便携式和手持式电子设备, 以及各种仪器和控制应用中。TDP 系列对于设计师来说很有吸引力, 因为它们密封处理使其适合表面贴装焊接与清洗, 并具有侧面起动, 以便在水平应用中直接看到指示开/关的位置。

特点

  • First ultra-miniature SMT half-pitch side-actuated DIP
  • Side actuation allows visual indication of on/off position in horizontal applications
  • Process sealed for surface mount soldering and washable processing

典型应用

  • Hand-held electronic devices
  • Portable computer and electronic devices
  • Instrumentation and controls

产品规格

  • Contact Rating:

    24 V DC, 25 mA (switching; 50 V DC, 100 mA (steady state)

  • Electrical Life:

    1,000 cycles

  • Contact Resistance:

    100 milliohms max.

  • Insulation Resistance:

    100 megohms @ 100 V DC min.

  • Dielectric Strength:

    300 V AC min.

  • Operating Temperature:

    –40°C to 85°C.

  • Solderability:

    Per MIL-STD-202F method 208D, or EIA RS-186E method 9 (1 hour steam aging)

TDP08H1SBD1R

  • 最常见的:

    Yes

  • Current Rating:

    25mA

  • Circuit:

    SPST

  • Mounting Type:

    SMT, Right Angle

  • Sealing:

    Unsealed

  • Illumination:

    No/None

  • Number of Positions:

    8

  • Electrical Life Cycles:

    1,000

  • Pitch:

    0.050" (1.27mm), Half

  • Termination Style:

    Gull Wing

  • Height Above Board:

    0.161" (4.10mm)

  • Actuator Type:

    Piano

  • Actuator Level:

    Raised

  • Washable:

    No

  • Process Features:

  • Contact Material:

    Copper Alloy

  • Contact Finish:

    Gold

  • Voltage Rating:

    24VDC

  • Packaging:

    Tape & Reel